HiFlow® HF610F-2

180°C Bi-component Epoxy System for Fast Cure Resin Transfer Molding

HiFlow® HF610F-2 is a two-component aerospace resin system designed for HP-RTM and C-RTM processes. Offering service temperatures from -60°C to +120°C, it enables a full cure in just 30 minutes at 180°C without post-curing, helping reduce production cycle times. Supplied as separate liquid components, it allows room-temperature storage for up to 12 months and can be shipped by air. Compatible with HexForce® and HiMax® reinforcements, as well as Hexcel binders and veils, it provides excellent processability, preform stability, and composite performance.

Shown here is the G0926 E01 demonstrator, produced using this technology. Images courtesy of KraussMaffei and Alpex Technologies.